Paras Semiconductors and BroadPak partner for advanced semiconductor packaging in India

Paras Semiconductors, a subsidiary of Paras Defence and Space Technologies, announced a strategic technology partnership with BroadPak Corporation to accelerate advanced semiconductor packaging capabilities in India. The partnership aims to establish an advanced heterogeneous integration and 3D packaging OSAT facility in India.

“Paras Semiconductors, a subsidiary of Paras Defence & Space Technologies Limited, announced a strategic technology partnership with BroadPak Corporation, USA, to accelerate the development of advanced semiconductor packaging capabilities in India”economictimes.indiatimes.com

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• economictimes.indiatimes.comParas Semiconductors: Paras Semiconductors, BroadPak join hands to build advanced semiconductor packaging capabilities - The Economic TimesPTINov 6, 2026

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