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Hubei Maipuen Semiconductor Co., Ltd. signed an agreement to build a technology R&D center and high-end semiconductor components manufacturing base in Wangji Street, Xinzhou District, Wuhan. The total investment is about 84 million yuan, with construction in two phases: Phase I expected to start production in H2 2027, and full completion by end of 2028. The facility will have an annual capacity of 270,000 high-precision semiconductor components and create over 190 jobs.
“麦普恩半导体项目采用分期建设、梯度投产模式稳步推进。一期将建设两栋主体生产建筑,预计2027年下半年建成投产”aivote.com
Summarized from public sources; check the original articles before acting on it.