Forehope Electronic plans CNY 10.3B high-end chip packaging plant in Yuyao

Forehope Electronic announced plans to invest CNY 10.3 billion (USD 1.5 billion) in the third phase of its project at the Sino-Italy Ningbo Ecological Park in Yuyao, China. The plant will use advanced packaging technologies including BUMP, 2.5D, FC, and WB, with construction over 96 months.

“The expansion is focused on cutting-edge packaging processes that are among the most advanced in the industry.”yicaiglobal.com

• 1 source
• yicaiglobal.comChina’s Forehope Electronic Pops After Unveiling Plan for USD1.5 Billion High-End Chip Packaging PlantTang ShihuaJun 29, 2026

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