# XCIP TECHNOLOGIES PTE. LTD.

- Headquarters: Singapore



## Announcements (1)

- 2026-08-07: [Powerchip and Broadcom establish panel-level advanced packaging JV in Singapore](https://endata.com/announcements/111396-powerchip-and-broadcom-establish-panel-level-advanced-packaging-jv-in-singapore) (Acquisition · Singapore, Singapore · $5.66B)

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.