# Hanmi Semiconductor signs KRW 8.05B supply contract with ASE

Hanmi Semiconductor signed a supply contract worth KRW 8.05 billion (USD 5.88 million) with Taiwan's ASE for FLIP CHIP BONDER semiconductor manufacturing equipment. The contract period runs from May 27, 2025 to September 26, 2025.

- Type: Contract
- Announced: 2025-05-27
- Where: Taiwan, TWN
- Value: $5.88M (8.05B KRW)
- Status: announced
- Products: FLIP CHIP BONDER semiconductor manufacturing equipment
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Hanmi Semiconductor](https://endata.com/companies/22183.md)
- [Advanced Semiconductor Engineering](https://endata.com/companies/19708.md) (customer)

## Sources

- [kstockbriefing.com](https://kstockbriefing.com/disclosure-hanmi-semiconductor-042700-secures-8b-krw-flip-chip-bonder-order-from-worlds-no-1-osat-giant-ase-in-taiwan/), 2025-05-28: "The company signed a supply contract worth KRW 8.05B with Taiwan’s ASE for ‘FLIP CHIP BONDER’ semiconductor manufacturing equipment."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.