# Hanmi Semiconductor receives additional TC bonder order from Micron

Hanmi Semiconductor has received additional orders for thermo-compression bonding (TCB) equipment from Micron Technology, according to South Korean media reports.

- Type: Contract
- Announced: 2025-04-22
- Status: announced
- Products: thermo-compression bonding (TCB) equipment
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Micron Technology](https://endata.com/companies/16026.md) (customer)
- [Hanmi Semiconductor](https://endata.com/companies/22183.md) (supplier)

## Sources

- [lcdproduct.com](https://lcdproduct.com/hanmi-semiconductors-tough-stance-against-sk-hynix-supported-by-large-tc-bonder-order-from-micron/), 2025-04-22: "Hanmi Semiconductor has received additional orders for thermo-compression bonding (TCB) equipment from Micron Technology."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.