# STMicroelectronics launches program to reshape manufacturing footprint and cut costs

STMicroelectronics announced a company-wide program to reshape its global manufacturing footprint and resize its cost base, with planned investments over FY2025-2027 focusing on advanced manufacturing infrastructure in 300mm silicon and 200mm silicon carbide, and up to 2,800 voluntary departures over three years.

- Type: Investment
- Announced: 2025-04-10
- Where: Europe (Italy and France), France
- Jobs: -2,800
- Status: announced
- Products: 300mm silicon wafers, 200mm silicon carbide wafers
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [STMicroelectronics](https://endata.com/companies/21952.md)

## Sources

- [nasdaq.com](https://www.nasdaq.com/press-release/stmicroelectronics-details-company-wide-program-reshape-manufacturing-footprint-and-0), 2025-04-10: "The reshaping of our manufacturing footprint announced today will future proof our Integrated Device Manufacturer model with strategic assets in Europe and improve our ability to innovate even faster, benefitting all our stakeholders."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.