# Yaxin Microelectronics starts construction of $550M semiconductor plant in Jingmen

Yaxin Microelectronics (Zhejiang Yaxin Microelectronics Co., Ltd.) has started construction of a semiconductor wafer manufacturing and chip packaging/testing project in Dongbao District, Jingmen, Hubei. The total investment is 40 billion yuan (approx. $5.5 billion), with Phase I (30 billion yuan) building a 6-inch wafer line and packaging/testing lines, and Phase II (10 billion yuan) adding a lead frame line.

- Type: New facility
- Announced: 2025-04-03
- Where: Dongbao District, Jingmen, Hubei, China
- Value: $5.50B (40.0B CNY)
- Status: under construction
- Capacity: 100 billion chips/year, 1 million wafers/year
- Products: 6-inch wafers, semiconductor packaging and testing, lead frames
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Zhejiang Yaxin Microelectronics](https://endata.com/companies/83982.md)

## Sources

- [casmita.com](https://www.casmita.com/news/202504/07/18487.html), 2025-04-07: "项目投产后，可年产芯片100亿颗、晶圆100万片，年产值40亿元、税收8000万元以上"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.