# RRP Electronics signs MoU with Deca Technologies for wafer-level chip packaging

RRP Electronics has signed a MoU with Deca Technologies to acquire wafer-level chip packaging capabilities. RRP will invest $150 million to integrate Deca's WLCSP and FOWLP technologies, with qualification tests expected by August 2025.

- Type: Partnership
- Announced: 2025-02-26
- Where: India
- Value: $150.0M
- Status: announced
- Products: wafer-level chip scale packaging, fan-out wafer-level packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [RRP Electronics](https://endata.com/companies/76276.md)
- [Deca Technologies](https://endata.com/companies/42468.md) (partner)

## Sources

- [thehindu.com](https://www.thehindu.com/business/rrp-electronics-signs-mou-with-deca-technologies-to-acquire-wafer-level-chip-packaging-capability/article69266687.ece), 2025-02-26: "We are investing in a large-scale Technology Transfer License Agreement (TTLA) with Deca, potentially on exclusive terms, to create a fully automated, world-class infrastructure."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.