# Chiplet Semiconductor starts construction of advanced packaging module plant in Nantong

Chiplet Semiconductor (Nantong) Co., Ltd. began construction of a CNY 1.05 billion advanced packaging (Chiplets) module manufacturing plant at Nantong High-tech Zone on February 9, 2025.

- Type: New facility
- Announced: 2025-02-09
- Where: Nantong, Jiangsu, China
- Value: $145.0M (1.05B CNY)
- Status: under construction
- Products: Chiplet advanced packaging modules
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Chiplet Semiconductor (Nantong)](https://endata.com/companies/82831.md)

## Sources

- [tongzhou.gov.cn](http://www.tongzhou.gov.cn/tzqrmzf/qwldhd/content/18f5e41b-005c-4ed7-8441-d978e150258d.html), 2025-02-09: "此次开工的制局半导体（南通）有限公司先进封装（Chiplets）模组制造项目总投资10.5亿元。"

---
Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.