# Zhonghuan Leading plans CNY 1.134 billion expansion of silicon wafer capacity in Yixing

Zhonghuan Leading Semiconductor Technology plans to invest CNY 1.134 billion in 2025 to expand its semiconductor silicon wafer project in Yixing, adding 8-inch and 12-inch polishing lines to reach monthly capacities of 900,000 8-inch wafers and 700,000 12-inch wafers.

- Type: Expansion
- Announced: 2025-02-06
- Where: Yixing, Jiangsu, China
- Value: $156.0M (1.13B CNY)
- Status: announced
- Capacity: 8-inch wafers: 900,000/month; 12-inch wafers: 700,000/month
- Products: 8-inch and 12-inch semiconductor silicon wafers
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Zhonghuan Leading Semiconductor Technology](https://endata.com/companies/82769.md)

## Sources

- [yixing.gov.cn](http://www.yixing.gov.cn/doc/2025/02/06/1292531.shtml), 2025-02-06: "全年计划投资11.34亿元，重点用于扩建半导体大硅片项目，新增8英寸和12英寸抛光产线"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.