# Dongcai Technology plans 20,000-ton high-speed resin project in Meishan

Dongcai Technology, through its subsidiary Meishan Dongcai, plans to invest CNY 700 million to build a 20,000-ton-per-year high-speed communication substrate electronic materials project in Meishan, Sichuan, China. The project has a construction period of 24 months.

- Type: Investment
- Announced: 2025-01-15
- Where: Meishan, Sichuan, China
- Value: $96.0M (700.0M CNY)
- Status: announced
- Capacity: 20,000 tons per year
- Products: high-speed communication substrate electronic materials, electronic-grade bismaleimide resin, low-dielectric active ester curing agent resin, low-dielectric thermosetting polyphenylene ether resin
- Sectors: [Specialty Chemicals](https://endata.com/sectors/specialty-chemicals.md), [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Dongcai Technology](https://endata.com/companies/82341.md)
- [Meishan Dongcai](https://endata.com/companies/82342.md)

## Sources

- [vzkoo.com](https://www.vzkoo.com/read/20250115c90e163ef2d2b8467b9d155f.html), 2025-01-15: "东材科技拟通过孙公司眉山东材在四川省眉山市投资建设'年产 2 万吨高速通信基板用电子材料项目'。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.