# Hanmi Semiconductor wins HBM equipment order from SK Hynix

Hanmi Semiconductor announced it signed a contract with SK Hynix to supply TC bonder equipment for HBM3E 12-layer product manufacturing, worth about 10.8 billion won, with a contract period until July 1, 2025.

- Type: Contract
- Announced: 2025-01-14
- Where: South Korea
- Value: $8.10M (10.8B KRW)
- Status: announced
- Products: TC bonder for HBM3E
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Hanmi Semiconductor](https://endata.com/companies/22183.md)
- [SK Hynix](https://endata.com/companies/2769.md) (customer)

## Sources

- [mk.co.kr](https://www.mk.co.kr/en/business/11217636), 2025-01-14: "Hanmi Semiconductor announced on the 14th that it has signed a contract with SK Hynix to win equipment for manufacturing high-bandwidth memory (HBM) worth about 10.8 billion won."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.