# Micron breaks ground on $7B HBM advanced packaging facility in Singapore

Micron Technology broke ground on a new High-Bandwidth Memory advanced packaging facility in Singapore, with an investment of approximately $7 billion. Operations are scheduled to begin in 2026, with capacity expansion starting in 2027, creating around 1,400 jobs initially.

- Type: New facility
- Announced: 2025-01-08
- Where: Singapore, Singapore
- Value: $7.00B
- Jobs: 1,400
- Starts operating: 2026
- Status: under construction
- Products: High-Bandwidth Memory (HBM) advanced packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Micron Technology](https://endata.com/companies/16026.md)

## Sources

- [micron.gcs-web.com](https://micron.gcs-web.com/news-releases/news-release-details/micron-breaks-ground-new-hbm-advanced-packaging-facility), 2025-01-08: "As AI adoption proliferates across industries, the demand for advanced memory and storage solutions will continue to increase robustly."
- [manufacturing.economictimes.indiatimes.com](https://manufacturing.economictimes.indiatimes.com/news/hi-tech/micron-to-invest-7-bn-in-spore-memory-chip-plant/117083467), 2025-01-09: "The US company broke ground on a new facility in the city-state on Wednesday, saying the plant is set to start operating in 2026."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.