# 慧通芯安 to build $36M AI sensor chip plant in Pingdingshan, China

河南慧通芯安科技有限公司 (Huitong Xin'an) started construction of a high-performance AI sensor chip R&D and manufacturing project in the Henan Electronic Semiconductor Industrial Park, Pingdingshan. The project involves a total investment of 260 million yuan and plans to produce 1.2 million chip-level modules per year.

- Type: New facility
- Announced: 2025-01-05
- Where: Pingdingshan, Henan, China
- Value: $36.0M (260.0M CNY)
- Status: under construction
- Capacity: 120万片芯片级模组/年
- Products: AI sensor chips, chip-level modules
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies


## Sources

- [weidong.gov.cn](https://www.weidong.gov.cn/contents/10983/47679.html), 2025-01-06: "该项目由河南慧通芯安科技有限公司投资建设，总投资2.6亿元，规划建设年产120万片芯片级模组生产线及AI系列产品。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.