# Hanmi Semiconductor breaks ground on 7th HBM TC Bonder factory in Incheon

Hanmi Semiconductor held the groundbreaking ceremony for its seventh TC Bonder factory in Seo-gu, Incheon. The two-story building with 14,400 m² floor area is scheduled for completion in Q4 2025 and will manufacture TC Bonders for HBM3E memory to be supplied to NVIDIA and Broadcom.

- Type: New facility
- Announced: 2025-01-06
- Where: Seo-gu, Incheon, South Korea
- Starts operating: Q4 2025
- Status: under construction
- Capacity: up to 2 trillion won in revenue
- Products: TC Bonder equipment for HBM manufacturing
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Hanmi Semiconductor](https://endata.com/companies/22183.md)

## Sources

- [biz.chosun.com](https://biz.chosun.com/en/en-industry/2025/01/06/KUGJBQF7DVEJZIVGK3U3YUKCYA/), 2025-01-06: "Hanmi Semiconductor has started construction of an additional TC Bonder factory to have production capacity ahead of the demand in the HBM market."
- [pulse.mk.co.kr](https://pulse.mk.co.kr/news/english/11211519), 2025-01-07: "Hanmi Semiconductor Co. held a groundbreaking ceremony on Monday for its new factory to manufacture thermocompression bonding (TC) bonders, a key device in high-bandwidth memory (HBM)."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.