# Dawon Nexview wins KRW 4.5B probe card bonding equipment supply contract

Dawon Nexview announced a KRW 4.54 billion contract to supply pLSMB HSB (High Speed Bonder) equipment to a domestic probe card manufacturer. The contract runs from December 20, 2024 to May 31, 2025.

- Type: Contract
- Announced: 2024-12-20
- Where: South Korea
- Status: announced
- Products: probe card bonding equipment, High Speed Bonder
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Dawon Nexview](https://endata.com/companies/80758.md)

## Sources

- [newsis.com](https://www.newsis.com/view/NISX20241220_0003005241), 2024-12-20: "이번 계약은 글로벌 반도체 기업에 부품을 납품하는 기업과 추가 공급 계약을 진행하는 것으로 중요한 의미가 있다"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.