# UMC wins Qualcomm advanced packaging deal for HPC chips

United Microelectronics Corporation (UMC) has reportedly secured an advanced packaging order from Qualcomm for high-performance computing chips, breaking TSMC's monopoly. The chips are expected to enter trial production in H2 2025 and mass production in 2026.

- Type: Contract
- Announced: 2024-12-17
- Status: announced
- Products: advanced packaging for HPC chips, interposers, Wafer-on-Wafer hybrid bonding
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [United Microelectronics Corporation](https://endata.com/companies/19674.md)
- [Qualcomm](https://endata.com/companies/16058.md) (customer)

## Sources

- [trendforce.com](https://www.trendforce.com/news/2024/12/17/news-umc-reportedly-wins-qualcomm-advanced-packaging-deal-breaking-tsmcs-monopoly/), 2024-12-17: "UMC has secured a major advanced packaging order from Qualcomm for high-performance computing (HPC) applications."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.