# Foxsem plans $80 million chip production expansion in Vietnam

Foxconn's packaging subsidiary Foxsem plans to invest $80 million to expand chip manufacturing capacity at its Bắc Giang facility in Vietnam. The expansion will focus on Co-Packaged Optics (CPO) components, with full-scale mass production expected by December 2026 and annual capacity reaching 4.5 million units.

- Type: Expansion
- Announced: 2024-11-05
- Where: Bắc Giang, Vietnam
- Value: $80.0M
- Starts operating: Dec 2026
- Status: announced
- Capacity: 4.5 million units per year
- Products: Co-Packaged Optics (CPO) components
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Foxsem](https://endata.com/companies/81187.md)
- [Foxconn](https://endata.com/companies/15170.md) (investor)

## Sources

- [ic-online.com](https://www.ic-online.com/blog/post/foxconn-subsidiary-plans-80-million-expansion-in-vietnam-for-chip-production), 2024-11-05: "Foxconn's packaging subsidiary, Foxsem, is set to invest $80 million to increase its chip manufacturing capacity in Vietnam."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.