# Beijing Yandong Microelectronics leads $4.6B 12-inch wafer fab project

Beijing is spending 33 billion yuan ($4.6 billion) to build a 12-inch wafer fabrication facility, led by Beijing Yandong Microelectronics (YDME) with a 24.95% stake, and including BOE Technology as an investor. The announcement was made on November 16, 2024.

- Type: New facility
- Announced: 2024-11-16
- Where: Beijing, China
- Value: $4.60B (33.0B CNY)
- Status: announced
- Products: 12-inch wafers
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Beijing Yandong Microelectronics Co. Ltd.](https://endata.com/companies/35619.md)
- [BOE Technology Group](https://endata.com/companies/22751.md) (investor)
- [Beijing Electronics IC Manufacturing](https://endata.com/companies/81048.md) (partner)

## Sources

- [scmp.com](https://www.scmp.com/tech/policy/article/3286857/beijing-plans-12-inch-wafer-fab-pouring-us46-billion-state-backed-chip-project), 2024-11-16: "Beijing is set to spend 33 billion yuan (US$4.6 billion) building a 12-inch wafer fabrication facility."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.