# Sumitomo Bakelite completes new plant for semiconductor encapsulation materials in Suzhou

Sumitomo Bakelite (Suzhou) has completed construction of a new plant for epoxy resin molding compounds for semiconductor encapsulation in Suzhou Industrial Park. The plant will expand total production capacity by 1.3 times and is scheduled to begin mass production in 2025.

- Type: Expansion
- Announced: 2024-10-28
- Where: Suzhou Industrial Park, Suzhou, China, China
- Starts operating: 2025
- Status: completed
- Capacity: 1.3 times previous capacity
- Products: epoxy resin molding compounds for semiconductor encapsulation
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md), [Specialty Chemicals](https://endata.com/sectors/specialty-chemicals.md)

## Companies

- [Sumitomo Bakelite](https://endata.com/companies/11098.md)
- [Sumitomo Bakelite (Suzhou)](https://endata.com/companies/80704.md) (partner)

## Sources

- [sumibe.co.jp](https://www.sumibe.co.jp/english/topics/2024/it-materials/0924_01/index.html), 2024-10-28: "The new plant will ensure sufficient supply capacity by securing new land and building a plant in the Suzhou Industrial Park so as to expand SSB's total production capacity by 1.3 times."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.