# SK Hynix orders TC bonding equipment from ASMPT

SK Hynix has ordered over 30 TC bonding devices from ASMPT for the production of its 12-layer HBM3E high bandwidth memory chips. The equipment will be used in MR-MUF packaging technology.

- Type: Contract
- Announced: 2024-10-15
- Where: South Korea
- Status: announced
- Products: TC bonding devices, HBM3E memory chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [SK Hynix](https://endata.com/companies/2769.md) (customer)
- [ASMPT](https://endata.com/companies/58024.md) (supplier)

## Sources

- [rxelectronics.com](https://www.rxelectronics.com/news/sk-hynix-orders-tc-bonding-equipment-from-asmpt.html), 2024-10-15: "SK Hynix has ordered over 30 TC bonding devices from well-known packaging and testing equipment manufacturer ASMPT for the production of its latest generation of high bandwidth memory chips -12 layer HBM3E."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.