# TTM Technologies holds beam-signing for $130M PCB facility in DeWitt, New York

TTM Technologies held a beam-signing ceremony for its $130 million expansion project in DeWitt, New York. The new facility will produce ultra high-density interconnect printed circuit boards for U.S. military applications and is expected to create 400 new jobs.

- Type: Expansion
- Announced: 2024-10-04
- Where: DeWitt, New York, United States
- Value: $130.0M
- Jobs: 400
- Status: under construction
- Products: ultra high-density interconnect printed circuit boards
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [TTM Technologies](https://endata.com/companies/28532.md)

## Sources

- [cnybj.com](https://www.cnybj.com/ttm-technologies-holds-beam-signing-event-as-expansion-project-continues/), 2024-10-07: "TTM is expected to invest up to $130 million for the new facility and create an additional 400 good paying jobs."
- [cnybj.com](https://www.cnybj.com/signing-the-beam-at-ttms-expansion-site-in-dewitt/), 2024-10-18: "TTM is expected to invest up to $130 million for the new facility and create an additional 400 'good paying' jobs."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.