# Amkor and TSMC to collaborate on advanced packaging in Arizona

Amkor Technology and TSMC signed a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona. TSMC will contract turnkey advanced packaging and test services from Amkor's planned facility in Peoria, Arizona.

- Type: Partnership
- Announced: 2024-10-03
- Where: Peoria, Arizona, United States
- Status: announced
- Products: advanced packaging, test services, InFO, CoWoS
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [TSMC](https://endata.com/companies/15886.md) (partner)
- [Amkor Technology](https://endata.com/companies/21914.md) (partner)

## Sources

- [ir.amkor.com](https://ir.amkor.com/news-releases/news-release-details/amkor-and-tsmc-expand-partnership-and-collaborate-advanced), 2024-10-03: "Amkor Technology, Inc. and TSMC announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.