# SDIC Microelectronics mulls acquiring 70% of Chipbond Technology unit

SDIC Microelectronics is considering acquiring up to 70% of a unit of Chipbond Technology for 140 million yuan.

- Type: Acquisition
- Announced: 2024-09-20
- Value: $19.4M (140.0M CNY)
- Status: rumored
- Products: semiconductor packaging and testing
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Chipbond Technology](https://endata.com/companies/50576.md) (target)
- [SDIC Microelectronics](https://endata.com/companies/79949.md) (acquirer)

## Sources

- [marketscreener.com](https://www.marketscreener.com/quote/index/SHANGHAI-STOCK-EXCHANGE-B-11252822/news/SDIC-Microelectronics-Mulls-Acquiring-Up-to-70-of-Chipbond-Technology-s-Unit-for-140-Million-Yuan-47906117/), 2024-09-20: "SDIC Microelectronics Mulls Acquiring Up to 70% of Chipbond Technology's Unit for 140 Million Yuan"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.