# TSMC breaks ground on first European factory in Dresden

TSMC, through joint venture ESMC, broke ground on a semiconductor fab in Dresden, Germany. Total investments exceed $11.1 billion (€10 billion), with EU approval of a $5.5 billion subsidy. The facility will produce 40,000 300mm wafers per month and create about 2,000 direct jobs.

- Type: New facility
- Announced: 2024-08-20
- Where: Dresden, Germany, Germany
- Value: $11.1B
- Jobs: 2,000
- Status: under construction
- Capacity: 40,000 300mm wafers per month
- Products: 300mm wafers on 28/22nm and 16/12nm process technology
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Taiwan Semiconductor Manufacturing Company](https://endata.com/companies/27337.md)
- [Robert Bosch](https://endata.com/companies/3006.md) (partner)
- [Infineon Technologies AG](https://endata.com/companies/15717.md) (partner)
- [NXP Semiconductors](https://endata.com/companies/19521.md) (partner)

## Sources

- [forbesmiddleeast.com](https://www.forbesmiddleeast.com/innovation/technology/tsmc-breaks-ground-on-first-european-factory-in-dresden-as-eu-approves-%2455b-german-subsidy), 2024-08-20: "With this state-of-the-art manufacturing facility, we will bring TSMC’s advanced manufacturing capabilities within reach of our European customers and partners."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.