# Hemlock Semiconductor completes Next-Generation Finishing facility in Michigan

Hemlock Semiconductor (HSC) completed its Next-Generation Finishing (NGF) facility in Michigan, representing a major investment in expanded production capacity for hyper-pure polysilicon for semiconductor and solar industries.

- Type: Expansion
- Announced: 2024-08-13
- Where: Michigan (Great Lakes Bay Region), United States
- Starts operating: 13 Aug 2024
- Status: completed
- Products: hyper-pure polysilicon
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Hemlock Semiconductor](https://endata.com/companies/49943.md)

## Sources

- [readmagazine.com](https://readmagazine.com/industries/semiconductor-electronics/hemlock-semiconductor-completes-next-gen-finishing-facility/), 2024-08-13: "Hemlock Semiconductor (HSC), the nation’s leading producer of hyper-pure polysilicon for the semiconductor and solar industries, is proud to announce the completion of its Next-Generation Finishing (NGF) facility."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.