# Amkor signs preliminary terms with US Commerce for $2B Arizona packaging facility

Amkor Technology signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive up to $400 million in direct funding and $200 million in loans under the CHIPS Act for its planned advanced packaging and test facility in Peoria, Arizona. Amkor projects to invest approximately $2 billion and employ about 2,000 people.

- Type: Investment
- Announced: 2024-07-26
- Where: Peoria, Arizona, United States
- Value: $2.00B
- Jobs: 2,000
- Starts operating: 2027
- Status: announced
- Capacity: 500,000 square feet of clean room space
- Products: advanced packaging, semiconductor test services
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Amkor Technology](https://endata.com/companies/21914.md)
- [US Department of Commerce](https://endata.com/companies/76815.md) (investor)

## Sources

- [ir.amkor.com](https://ir.amkor.com/news-releases/news-release-details/amkor-signs-preliminary-memorandum-terms-us-department-commerce), 2024-07-26: "Amkor announced today it has signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive proposed funding as part of the CHIPS and Science Act."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.