# Sanan Semiconductor begins equipment move-in for 8-inch SiC chip fab M6B

Sanan Semiconductor held an equipment move-in ceremony for its chip fab M6B, part of its 160 billion RMB SiC project. The fab is expected to achieve first light and start 8-inch SiC chip production by December 2024.

- Type: Expansion
- Announced: 2024-07-25
- Where: China
- Value: $22.0B (160.0B CNY)
- Starts operating: Dec 2024
- Status: under construction
- Capacity: 36万片6吋SiC晶圆/年, 48万片8吋SiC晶圆/年
- Products: 6-inch SiC wafers, 8-inch SiC wafers, SiC chips
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Sanan Semiconductor](https://endata.com/companies/78799.md)

## Sources

- [sanan-semiconductor.com](https://www.sanan-semiconductor.com/news-125), 2024-07-25: "这标志着三安SiC项目二期通线在即，将为全面加速8吋SiC产业布局，实现产线正式投产奠定良好基础。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.