# BAE Systems awarded $22M contract for microelectronics under STEAM PIPE

BAE Systems' FAST Labs organization has been awarded a $22 million contract by the Office of the Undersecretary of Defense for Research & Engineering to support the STEAM PIPE project. The work involves developing and delivering advanced chiplet prototypes for military systems.

- Type: Contract
- Announced: 2024-07-22
- Where: Merrimack, New Hampshire, United States
- Value: $22.0M
- Status: announced
- Products: advanced chiplet prototypes, microelectronics
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [BAE Systems](https://endata.com/companies/4538.md)

## Sources

- [businesswire.com](https://www.businesswire.com/news/home/20240722456495/en/BAE-Systems-to-Deliver-Advanced-Microelectronics-to-U.S.-Defense-Industrial-Base), 2024-07-22: "The Office of the Undersecretary of Defense for Research & Engineering's Trusted & Assured Microelectronics program ... has awarded BAE Systems' FAST Labs Research and Development organization a $22 million contract."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.