# VIS and NXP form $7.8 billion joint venture for wafer fab in Singapore

Vanguard International Semiconductor Corporation and NXP Semiconductors N.V. announced a proposed US$7.8 billion joint venture to build a new 300mm semiconductor wafer manufacturing facility in Singapore, supporting 130nm to 40nm products for automotive, industrial, consumer and mobile markets.

- Type: Investment
- Announced: 2024-07-22
- Where: Singapore, Singapore
- Value: $7.80B
- Status: announced
- Products: 300mm semiconductor wafers, mixed-signal, power management and analogue products
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [NXP Semiconductors](https://endata.com/companies/19521.md) (partner)
- [Vanguard International Semiconductor](https://endata.com/companies/36724.md) (partner)

## Sources

- [allenandgledhill.com](https://www.allenandgledhill.com/sg/perspectives/articles/28444/us-78-billion-joint-venture-between-vanguard-international-semiconductor-corporation-and-nxp-semiconductors-nv?agreed=), 2024-07-22: "The joint-venture fab will support 130nm to 40nm mixed-signal, power management and analogue products, targeting the automotive, industrial, consumer and mobile end markets."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.