# Resonac launches US-JOINT semiconductor packaging R&D consortium in Union City, California

Resonac Corporation unveiled a new consortium of ten partners called 'US-JOINT' for semiconductor back-end process R&D in Silicon Valley. The R&D will take place at a new center in Union City, Calif., set up through co-investment, with construction starting in 2024 and full operation expected in 2025.

- Type: Partnership
- Announced: 2024-07-08
- Where: Union City, California, United States
- Status: announced
- Products: semiconductor packaging, back-end process R&D
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Resonac](https://endata.com/companies/12729.md)
- [Ulvac](https://endata.com/companies/3800.md) (partner)
- [MEC](https://endata.com/companies/12533.md) (partner)
- [KLA Corp.](https://endata.com/companies/37465.md) (partner)
- [Kulicke & Soffa](https://endata.com/companies/50060.md) (partner)
- [TOWA Corporation](https://endata.com/companies/61822.md) (partner)
- [Azimuth](https://endata.com/companies/78493.md) (partner)
- [Moses Lake Industries](https://endata.com/companies/78494.md) (partner)
- [NAMICS](https://endata.com/companies/78495.md) (partner)
- [TOK](https://endata.com/companies/78496.md) (partner)

## Sources

- [eetimes.com](https://www.eetimes.com/u-s-japan-packaging-venture-launched/), 2024-07-08: "US-JOINT expands the activities of Japan-based open consortiums led by Resonac in the U.S. and includes the participation of five U.S.-based companies."

---
Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.