# BAE Systems and GlobalFoundries collaborate on secure chip manufacturing for aerospace and defense

BAE Systems and GlobalFoundries have agreed to align technology roadmaps and collaborate on R&D for packaging, GaN-on-Si, silicon photonics, and process development for secure chips used in aerospace and defense systems. The non-exclusive partnership leverages BAE's microelectronics expertise and GlobalFoundries' volume semiconductor manufacturing.

- Type: Partnership
- Announced: 2024-06-25
- Where: United States
- Status: announced
- Products: secure chips, GaN-on-Si, silicon photonics, radiation-hardened semiconductors
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md), [Aerospace Components](https://endata.com/sectors/aerospace-components.md)

## Companies

- [GlobalFoundries](https://endata.com/companies/664.md) (partner)
- [BAE Systems](https://endata.com/companies/4538.md) (partner)

## Sources

- [electronicsweekly.com](https://www.electronicsweekly.com/market-sectors/military-aerospace-electronics/bae-hooks-up-with-glofo-2024-06/), 2024-06-25: "BAE Systems and GlobalFoundries are to align technology roadmaps and collaborate on long-term strategies for US fabrication and packaging of secure chips for use in aerospace and defense systems."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.