# HANMI Semiconductor wins KRW 150B order from SK Hynix for HBM TC bonders

HANMI Semiconductor received a KRW 150 billion order from SK Hynix for its DUAL TC BONDER GRIFFIN, used in HBM production. Cumulative orders from SK Hynix for this equipment now total KRW 358.7 billion.

- Type: Contract
- Announced: 2024-06-07
- Where: South Korea
- Value: $108.0M (150.0B KRW)
- Status: announced
- Products: DUAL TC BONDER GRIFFIN, HBM TC bonder
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Hanmi Semiconductor](https://endata.com/companies/22183.md)
- [SK Hynix](https://endata.com/companies/2769.md) (customer)
- [Hanmi Semiconductor](https://endata.com/companies/22183.md) (supplier)

## Sources

- [hanmisemi.com](https://www.hanmisemi.com/en/news/new_view3.html), 2024-06-07: "한미반도체 대표 곽동신 부회장은 SK하이닉스로부터 인공지능(AI) 반도체 고대역폭메모리(HBM) 3세대 하이퍼 모델인 '듀얼 TC본더 그리핀 (DUAL TC BONDER GRIFFIN)'을 1500억원 규모로 수주했다고 7일 밝혔다."
- [kedglobal.com](https://www.kedglobal.com/us/korean-chipmakers/newsView/ked202406070008), 2024-06-07: "The contract amount is 149.9 billion won ($109.5 million)."
- [kedglobal.com](https://www.kedglobal.com/korean-chipmakers/newsView/ked202406070008), 2024-06-07: "The contract amount is 149.9 billion won ($109.5 million)."
- [mk.co.kr](https://www.mk.co.kr/en/business/11035936), 2024-06-07: "On the 7th, Korea-U.S. Semiconductor decided to supply the third-generation hypermodel 'Dual TC Bonder Griffin' for HBM to SK Hynix."
- [kstockbriefing.com](https://kstockbriefing.com/disclosure-hanmi-semiconductor-042700-secures-massive-149-9-billion-krw-hbm-equipment-contract-from-sk-hynix-blockbuster-deal-nearing-94-of-recent-annual-revenue/), 2024-06-07: "The company entered into a KRW 149.92B supply contract with SK Hynix for ‘DUAL TC BONDER GRIFFIN’ equipment used in HBM manufacturing."

---
Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.