# BAE Systems wins $12M DARPA contract for microelectronics heat removal

BAE Systems' FAST Labs was awarded a $12 million contract by DARPA for the THREADS programme, which aims to develop technologies for heat removal in microelectronics at the transistor scale.

- Type: Contract
- Announced: 2024-05-15
- Where: Nashua, New Hampshire, United States
- Value: $12.0M
- Status: announced
- Products: microelectronics heat removal technology, gallium nitride devices
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [BAE Systems](https://endata.com/companies/4538.md)
- [DARPA](https://endata.com/companies/34950.md) (customer)

## Sources

- [airforce-technology.com](https://www.airforce-technology.com/news/bae-wins-darpa-contract-for-microelectronics-heat-removal/), 2024-05-15: "Solving this challenge will improve the range of RF-based systems by nearly threefold, the new contractor says."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.