# BE Semiconductor to supply 26 hybrid bonding systems to major chipmaker

BE Semiconductor (Besi) announced it will supply 26 hybrid bonding systems to an unnamed major chip producer, likely Intel or TSMC. The systems will be delivered in Q4 2024-Q1 2025.

- Type: Contract
- Announced: 2024-05-13
- Status: announced
- Products: hybrid bonding systems
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [BE Semiconductor](https://endata.com/companies/77374.md)

## Sources

- [techzine.eu](https://www.techzine.eu/news/infrastructure/119844/be-semiconductor-closes-lucrative-chip-deal-with-presumably-intel/), 2024-05-13: "Besi currently supplies hybrid bonding machines to two customers, whose options are actually only TSMC and Intel."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.