# Hanmi Semiconductor signs 22.6 billion KRW TC Bonder contract with Micron

Hanmi Semiconductor has secured a supply contract worth 22.6 billion KRW from Micron Technology for its Dual TC Bonder Griffin equipment used in HBM3E memory production for AI semiconductors.

- Type: Contract
- Announced: 2024-04-11
- Where: United States
- Value: $16.8M (22.6B KRW)
- Status: announced
- Products: Dual TC Bonder Griffin, HBM3E memory
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Micron Technology](https://endata.com/companies/16026.md) (customer)
- [Hanmi Semiconductor](https://endata.com/companies/22183.md) (supplier)

## Sources

- [asiae.co.kr](https://www.asiae.co.kr/en/article/2024041109202470334), 2024-04-11: "Hanmi Semiconductor announced that it has secured a supply contract worth 22.6 billion KRW from the U.S. memory semiconductor company Micron Technology for the production of AI semiconductor high-bandwidth memory (HBM) using the ‘Dual TC Bonder Griffin’."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.