# Samsung wins Nvidia 2.5D packaging order

Samsung has won an order from Nvidia to provide its I-Cube 2.5D packaging for Nvidia's AI chips. Samsung's Advanced Package team will supply the interposer and packaging, while HBM and GPU wafer production will be handled by others.

- Type: Contract
- Announced: 2024-04-08
- Where: South Korea
- Status: announced
- Products: 2.5D packaging (I-Cube), interposer
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Samsung](https://endata.com/companies/5951.md) (supplier)
- [NVIDIA](https://endata.com/companies/11954.md) (customer)

## Sources

- [thelec.net](https://www.thelec.net/news/articleView.html?idxno=4795), 2024-04-07: "Samsung has won Nvidia as a customer for 2.5D packaging, TheElec has learned."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.