# SK Hynix to build $3.87B chip packaging fab in West Lafayette, Indiana

SK Hynix plans to build a $3.87 billion advanced chip packaging facility in West Lafayette, Indiana, creating over 1,000 jobs. Production is slated to begin in the second half of 2028.

- Type: New facility
- Announced: 2024-04-04
- Where: West Lafayette, Indiana, United States
- Value: $3.87B
- Jobs: 1,000
- Starts operating: Q3 2028
- Status: announced
- Capacity: 430000 square feet
- Products: high-bandwidth memory chips, advanced chip packaging for AI
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [SK Hynix](https://endata.com/companies/2769.md)
- [Purdue University](https://endata.com/companies/76637.md) (partner)

## Sources

- [manufacturingdive.com](https://www.manufacturingdive.com/news/sk-hynix-to-build-4-billion-advancing-packaging-fab-purdue-university/712256/), 2024-04-04: "The new facility, which SK Hynix has been teasing since last month, will create more than 1,000 new jobs."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.