# UMC secures order from Qorvo for next-gen iPhone chips

United Microelectronics Corporation (UMC) secured a significant order from Qorvo to manufacture chips using UMC's 3DIC technology for antenna components of next-generation iPhones.

- Type: Contract
- Announced: 2024-04-02
- Status: announced
- Products: 3DIC chips, radio frequency power amplifiers, antenna components
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [United Microelectronics Corporation](https://endata.com/companies/19674.md) (supplier)
- [Qorvo](https://endata.com/companies/20471.md) (customer)

## Sources

- [technode.com](https://technode.com/2024/04/02/umc-secures-major-order-from-qorvo-for-next-gen-iphones/), 2024-04-02: "United Microelectronics Corporation (UMC), a major player in semiconductor wafer foundry, has secured a significant order from Apple’s radio frequency power amplifier supplier Qorvo."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.