# Tongfu Microelectronics signs long-term packaging and testing deal with AMD

Tongfu Microelectronics has formed a strategic partnership with AMD and signed a long-term business agreement to provide packaging and testing services for AI, PC chips and AI accelerators. Tongfu is now AMD's largest packaging and testing supplier.

- Type: Contract
- Announced: 2024-02-21
- Status: announced
- Products: packaging and testing services for AI, PC chips and AI accelerators
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Tongfu Microelectronics Co., Ltd.](https://endata.com/companies/22832.md)
- [AMD](https://endata.com/companies/15370.md) (customer)

## Sources

- [semimedia.cc](https://www.semimedia.cc/tongfu-becomes-amds-largest-packaging-and-testing-supplier/), 2024-02-21: "Tongfu Microelectronics, a semiconductor packaging and testing company in mainland China, recently revealed in an interview that it has formed a close strategic partnership with AMD and signed a long-term business agreement to provide AMD with packaging and testing services for AI, PC chips and AI a"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.