# Wog Photoelectric to acquire 70% stake in Hubei Tonggewei

Wog Photoelectric plans to acquire a 70% stake in Hubei Tonggewei for 85.73 million yuan, gaining full ownership to accelerate construction of a chip board-level packaging substrate project.

- Type: Acquisition
- Announced: 2024-02-07
- Where: China
- Value: $11.9M (85.7M CNY)
- Status: announced
- Capacity: 1 million square meters of chip board-level packaging substrates per year
- Products: glass-based substrates for chip packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Wog Photoelectric](https://endata.com/companies/75524.md) (acquirer)
- [Hubei Tonggewei](https://endata.com/companies/75525.md) (target)

## Sources

- [finance.sina.cn](https://finance.sina.cn/2024-02-07/detail-inaheyrf5299730.d.html), 2024-02-07: "本次收购有利于进一步加快湖北通格微芯片板级封装载板项目建设进度。"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.