# Foxconn and HCL Group to form chip packaging and testing joint venture in India

Foxconn and HCL Group announced plans to form a joint venture for chip packaging and testing (OSAT) in India.

- Type: Partnership
- Announced: 2024-02-06
- Where: India
- Status: announced
- Products: chip packaging and testing services
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Foxconn](https://endata.com/companies/15170.md) (partner)
- [HCL Group](https://endata.com/companies/75062.md) (partner)

## Sources

- [quantumfabsemi.com](https://www.quantumfabsemi.com/foxconn-hcl-group-to-form-chip-packaging-testing-joint-venture-in-india/), 2024-02-06: "Foxconn, HCL Group to form chip packaging, testing joint venture in India"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.