# Raytheon awarded $20M contract to develop multi-chip package with AMD

Raytheon, an RTX business, has been awarded a $20 million contract through the S2 MARTS consortium to develop a next-generation multi-chip package for military sensors, using commercial devices from AMD and others.

- Type: Contract
- Announced: 2024-02-01
- Where: Lompoc, California, United States
- Value: $20.0M
- Status: announced
- Products: multi-chip package, microelectronics packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md), [Aerospace Components](https://endata.com/sectors/aerospace-components.md)

## Companies

- [Raytheon](https://endata.com/companies/19863.md)
- [AMD](https://endata.com/companies/15370.md) (partner)

## Sources

- [raytheon.mediaroom.com](https://raytheon.mediaroom.com/2024-02-01-RTX-works-with-AMD-to-develop-next-gen-Multi-Chip-Package), 2024-02-01: "Raytheon, an RTX business, has been awarded a $20 million contract through the Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S2 MARTS) consortium to develop a next-generation multi-chip package for use in ground, maritime and airborne sensors."
- [aviationweek.com](https://aviationweek.com/defense/sensors-electronic-warfare/raytheon-wins-20-million-contract-develop-advanced-chip-package), 2024-02-01: "Raytheon has been awarded a $20 million contract to develop an advanced multi-chip package for use in airborne, maritime and ground sensors."

---
Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.