# DOD awards $49 million for advanced semiconductor packaging

The U.S. Department of Defense awarded two contracts totaling $49 million to Micross Components and the government of Osceola County, Florida, to revitalize advanced packaging capabilities for semiconductors used in defense applications.

- Type: Contract
- Announced: 2024-01-24
- Where: Florida, United States
- Value: $49.0M
- Status: announced
- Products: advanced semiconductor packaging, 2.5D/3D packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [U.S. Department of Defense](https://endata.com/companies/4836.md) (customer)
- [Micross Components](https://endata.com/companies/26365.md) (supplier)
- [Osceola County, Florida](https://endata.com/companies/75212.md) (supplier)

## Sources

- [war.gov](https://www.war.gov/News/Releases/Release/Article/3655035/dod-awards-49-million-to-improve-advanced-semiconductor-packaging-capabilities/), 2024-01-24: "The Department of Defense announced today the award of two contracts totaling $49 million to revitalize advanced packaging capabilities and capacity for semiconductors used in defense applications."

---
Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.