# Foxconn and HCL Group form chip packaging joint venture in India

Foxconn (Hon Hai Precision Industry) partners with HCL Group to form a chip packaging and testing (OSAT) joint venture in India. Foxconn unit will invest $37.2 million for a 40% stake.

- Type: Partnership
- Announced: 2024-01-17
- Where: India
- Value: $37.2M
- Status: announced
- Products: chip packaging and testing services
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Foxconn](https://endata.com/companies/15170.md) (partner)
- [HCL Group](https://endata.com/companies/75062.md) (partner)

## Sources

- [moneycontrol.com](https://www.moneycontrol.com/news/business/foxconn-hcl-group-to-form-chip-packaging-testing-joint-venture-in-india-12070081.html), 2024-01-17: "Foxconn, also known as Hon Hai Precision Industry, said it is partnering with India’s HCL Group to start a chip packaging and testing venture in the country."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.