# EnSilica awarded initial mandate for telecoms ASIC worth over US$35 million

EnSilica entered into a binding Letter of Intent for the development and supply of a high-end ASIC for telecommunications infrastructure, with work starting in January 2024 and initial production anticipated by end of 2026; the final contract is expected to be worth over US$35 million over ten years.

- Type: Contract
- Announced: 2023-12-22
- Value: $35.0M
- Status: announced
- Products: high-end ASIC for telecommunications infrastructure
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [EnSilica](https://endata.com/companies/14760.md) (supplier)

## Sources

- [investegate.co.uk](https://www.investegate.co.uk/announcement/rns/ensilica--ensi/ensilica-awarded-initial-mandate-for-telecoms-asic/7957992), 2023-12-22: "EnSilica awarded initial mandate for a high-end telecoms ASIC worth in excess of US$35m"

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.