# Micross Components receives $134.3M DoD contract for advanced packaging

Micross Components received a $134.3 million award under the IBAS Cornerstone RESHAPE program from the U.S. Department of Defense to develop advanced packaging capabilities for secure microelectronics. The award includes $45.6 million obligated at the time of the award and will add 300mm wafer processing capabilities and expand 200mm wafer production capacity at its Raleigh, NC facility.

- Type: Contract
- Announced: 2023-11-27
- Where: Raleigh, North Carolina, United States
- Value: $134.3M
- Status: announced
- Products: advanced packaging, 2.5/3D advanced system integration and packaging, wafer-level packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Micross Components](https://endata.com/companies/26365.md)
- [U.S. Department of Defense](https://endata.com/companies/4836.md) (customer)

## Sources

- [prnewswire.com](https://www.prnewswire.com/news-releases/134-3m-dod-contract-expands-micross-advanced-interconnect-osat-capabilities-in-the-us-301997944.html), 2023-11-27: "The Defense Industrial Base will benefit from the RESHAPE on-shoring effort to further Advanced Packaging manufacturing capabilities with Micross Components."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.