# Micross receives $134M Army agreement for advanced packaging ecosystem

Micross Advanced Interconnect Technologies received a $134.3 million other transaction authority agreement from the U.S. Army to develop a domestic open-access ecosystem for 2.5D and 3D packaging production in Durham, North Carolina, through November 2028.

- Type: Contract
- Announced: 2023-11-14
- Where: Durham, North Carolina, United States
- Value: $134.3M
- Status: announced
- Products: 2.5D and 3D advanced packaging, microelectronics
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Micross Advanced Interconnect Technologies](https://endata.com/companies/73764.md)
- [U.S. Army](https://endata.com/companies/15558.md) (customer)
- [Micross Advanced Interconnect Technologies](https://endata.com/companies/73764.md) (supplier)

## Sources

- [govconwire.com](https://www.govconwire.com/articles/micross-secures-134m-army-advanced-packaging-ecosystem-cta-agreement), 2023-11-14: "Micross Advanced Interconnect Technologies has received a $134.3 million other transaction authority agreement from the U.S. Army to develop a domestic, open-access ecosystem for 2.5D and 3D packaging production."
- [afcea.org](https://www.afcea.org/signal-media/army-develops-semiconductor-packaging), 2023-12-06: "Micross Advanced Interconnect Technologies, Durham, North Carolina, was awarded an other transaction authority agreement with a ceiling of $134,269,798 to develop a domestic, trusted, pure-play and open-access advanced packaging ecosystem."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.