# Texas Instruments breaks ground on $11B semiconductor fab in Lehi, Utah

Texas Instruments broke ground on LFAB2, a new 300-mm semiconductor wafer fabrication plant in Lehi, Utah. The $11 billion investment is expected to create 800 jobs, with first production as early as 2026.

- Type: New facility
- Announced: 2023-11-02
- Where: Lehi, Utah, United States
- Value: $11.0B
- Jobs: 800
- Starts operating: 2026
- Status: under construction
- Capacity: tens of millions of analog and embedded processing chips per day at full production
- Products: analog and embedded processing semiconductors
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Texas Instruments](https://endata.com/companies/29167.md)

## Sources

- [ti.com](https://www.ti.com/about-ti/newsroom/news-releases/2023/2023-11-02-texas-instruments-breaks-ground-on-new-300-mm-semiconductor-wafer-fabrication-plant-in-utah.html), 2023-11-02: "Today we take an important step in our company's journey to expand our manufacturing footprint in Utah."
- [investor.ti.com](https://investor.ti.com/news-releases/news-release-details/texas-instruments-breaks-ground-new-300-mm-semiconductor-wafer-0), 2023-11-02: "This new fab is part of our long-term, 300-mm manufacturing roadmap to build the capacity our customers will need for decades to come."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.